'Prediction of interfacial reaction between Cu and In during low-temperature soldering'
Sang-Ho Oh, Kunmo Chu and Byeong-Joo Lee, accepted for publication in J Phase Equilibria & Diffusion.
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[Publication] High-entropy Alloy with Multi-strengthening Mec... 2022.10.21by Byeong-Joo Lee 〉Designed by sketchbooks.co.kr / sketchbook5 board skin
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